Membeli EP2S130F1508I4 dengan BYCHPS
Beli dengan jaminan
EP2S130F1508I4
- Nomor bagian:
- EP2S130F1508I4
- Pabrikan:
- Altera (Intel)
- Deskripsi:
- IC FPGA 1126 I/O 1508FBGA
- Memimpin Status Bebas / Status RoHS:
- Berisi timbal / RoHS tidak patuh
- Kuantitas yang Tersedia:
- 12225 Pieces
pengantar
BYCHIPS adalah distributor penyimpanan untuk EP2S130F1508I4, kami memiliki stok untuk pengiriman segera dan juga tersedia untuk pasokan jangka panjang. Harap kirimkan rencana pembelian Anda kepada kami EP2S130F1508I4 melalui email, kami akan memberikan harga terbaik sesuai rencana Anda.
Spesifikasi
| Tegangan - Pasokan: | 1.15 V ~ 1.25 V |
|---|---|
| Jumlah RAM Bits: | 6747840 |
| Paket Perangkat pemasok: | 1508-FBGA (30x30) |
| Seri: | Stratix® II |
| Paket / Case: | 1508-BBGA, FCBGA |
| Nama lain: | 544-2161 |
| Suhu Operasional: | -40°C ~ 100°C (TJ) |
| Jumlah Logic Elemen / Sel: | 132540 |
| Jumlah laboratorium / CLBs: | 6627 |
| Jumlah I / O: | 1126 |
| mount Jenis: | Surface Mount |
| Tingkat Sensitivitas Kelembaban (MSL): | 3 (168 Hours) |
| Manufacturer Standard Lead Time: | 11 Weeks |
| Nomor Bagian Produsen: | EP2S130F1508I4 |
| Deskripsi: | IC FPGA 1126 I/O 1508FBGA |
| Email: | sales@bychips.com |
bagian terkait untuk EP2S130F1508I4
| Gambar | Nomor bagian | Produsen | Deskripsi | Melihat |
|---|---|---|---|---|
 |
EP2S130F1508I5 | Altera | IC FPGA 1126 I/O 1508FBGA | Penyelidikan |
|
EP2S130F1508C3N | Altera | IC FPGA 1126 I/O 1508FBGA | Penyelidikan |
|
EP2S130F1508C3 | Altera | IC FPGA 1126 I/O 1508FBGA | Penyelidikan |
|
EP2S130F1508C5N | Altera | IC FPGA 1126 I/O 1508FBGA | Penyelidikan |
|
EP2S130F1508I4N | Altera | IC FPGA 1126 I/O 1508FBGA | Penyelidikan |
|
EP2S130F1508C4 | Altera | IC FPGA 1126 I/O 1508FBGA | Penyelidikan |
|
EP2S130F1508C5 | Altera | IC FPGA 1126 I/O 1508FBGA | Penyelidikan |
|
EP2S130F1508C4N | Altera | IC FPGA 1126 I/O 1508FBGA | Penyelidikan |
Lastest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers