Membeli MC8641DHX1333JE dengan BYCHPS
Beli dengan jaminan
MC8641DHX1333JE
- Nomor bagian:
- MC8641DHX1333JE
- Pabrikan:
- NXP Semiconductors / Freescale
- Deskripsi:
- IC MPU MPC86XX 1.333GHZ 1023BGA
- Memimpin Status Bebas / Status RoHS:
- Berisi timbal / RoHS tidak patuh
- Kuantitas yang Tersedia:
- 15928 Pieces
- Lembaran data:
- 1.MC8641DHX1333JE.pdf2.MC8641DHX1333JE.pdf
pengantar
BYCHIPS adalah distributor penyimpanan untuk MC8641DHX1333JE, kami memiliki stok untuk pengiriman segera dan juga tersedia untuk pasokan jangka panjang. Harap kirimkan rencana pembelian Anda kepada kami MC8641DHX1333JE melalui email, kami akan memberikan harga terbaik sesuai rencana Anda.
Spesifikasi
| Tegangan - I / O: | 1.8V, 2.5V, 3.3V |
|---|---|
| USB: | - |
| Paket Perangkat pemasok: | 1023-FCCBGA (33x33) |
| Kecepatan: | 1.333GHz |
| Seri: | MPC86xx |
| Fitur keamanan: | - |
| SATA: | - |
| Pengontrol RAM: | DDR, DDR2 |
| Pengemasan: | Tray |
| Paket / Case: | 1023-BCBGA, FCCBGA |
| Nama lain: | 935310139557 |
| Suhu Operasional: | 0°C ~ 105°C (TA) |
| Jumlah Lengan / Lebar Bus: | 2 Core, 32-Bit |
| Tingkat Sensitivitas Kelembaban (MSL): | 3 (168 Hours) |
| Nomor Bagian Produsen: | MC8641DHX1333JE |
| Akselerasi Grafis: | No |
| Deskripsi yang Diperluas: | PowerPC e600 Microprocessor IC MPC86xx 2 Core, 32-Bit 1.333GHz 1023-FCCBGA (33x33) |
| Ethernet: | 10/100/1000 Mbps (4) |
| Display & Interface Controller: | - |
| Deskripsi: | IC MPU MPC86XX 1.333GHZ 1023BGA |
| core Processor: | PowerPC e600 |
| Co-Prosesor / DSP: | - |
| Antarmuka Tambahan: | DUART, HSSI, I²C, RapidIO |
| Email: | [email protected] |
bagian terkait untuk MC8641DHX1333JE
Lastest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers