Membeli MPC8315ECVRADDA dengan BYCHPS
Beli dengan jaminan
MPC8315ECVRADDA
- Nomor bagian:
- MPC8315ECVRADDA
- Pabrikan:
- NXP Semiconductors / Freescale
- Deskripsi:
- IC MPU MPC83XX 266MHZ 620BGA
- Memimpin Status Bebas / Status RoHS:
- Memimpin bebas / RoHS Compliant
- Kuantitas yang Tersedia:
- 16788 Pieces
pengantar
BYCHIPS adalah distributor penyimpanan untuk MPC8315ECVRADDA, kami memiliki stok untuk pengiriman segera dan juga tersedia untuk pasokan jangka panjang. Harap kirimkan rencana pembelian Anda kepada kami MPC8315ECVRADDA melalui email, kami akan memberikan harga terbaik sesuai rencana Anda.
Spesifikasi
| Tegangan - I / O: | 1.8V, 2.5V, 3.3V |
|---|---|
| USB: | USB 2.0 + PHY (1) |
| Paket Perangkat pemasok: | 620-PBGA (29x29) |
| Kecepatan: | 266MHz |
| Seri: | MPC83xx |
| Fitur keamanan: | Cryptography, Random Number Generator |
| SATA: | SATA 3Gbps (2) |
| Pengontrol RAM: | DDR, DDR2 |
| Pengemasan: | Tray |
| Paket / Case: | 620-BBGA Exposed Pad |
| Suhu Operasional: | -40°C ~ 105°C (TA) |
| Jumlah Lengan / Lebar Bus: | 1 Core, 32-Bit |
| Tingkat Sensitivitas Kelembaban (MSL): | 3 (168 Hours) |
| Nomor Bagian Produsen: | MPC8315ECVRADDA |
| Akselerasi Grafis: | No |
| Deskripsi yang Diperluas: | PowerPC e300c3 Microprocessor IC MPC83xx 1 Core, 32-Bit 266MHz 620-PBGA (29x29) |
| Ethernet: | 10/100/1000 Mbps (2) |
| Display & Interface Controller: | - |
| Deskripsi: | IC MPU MPC83XX 266MHZ 620BGA |
| core Processor: | PowerPC e300c3 |
| Co-Prosesor / DSP: | Security; SEC 3.3 |
| Antarmuka Tambahan: | DUART, I²C, PCI, SPI, TDM |
| Email: | [email protected] |
bagian terkait untuk MPC8315ECVRADDA
Lastest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers