Membeli MPC8547EPXAQGB dengan BYCHPS
Beli dengan jaminan
MPC8547EPXAQGB
- Nomor bagian:
- MPC8547EPXAQGB
- Pabrikan:
- NXP Semiconductors / Freescale
- Deskripsi:
- IC MPU MPC85XX 1.0GHZ 783FCBGA
- Memimpin Status Bebas / Status RoHS:
- Memimpin bebas / RoHS Compliant
- Kuantitas yang Tersedia:
- 12684 Pieces
pengantar
BYCHIPS adalah distributor penyimpanan untuk MPC8547EPXAQGB, kami memiliki stok untuk pengiriman segera dan juga tersedia untuk pasokan jangka panjang. Harap kirimkan rencana pembelian Anda kepada kami MPC8547EPXAQGB melalui email, kami akan memberikan harga terbaik sesuai rencana Anda.
Spesifikasi
| Tegangan - I / O: | 1.8V, 2.5V, 3.3V |
|---|---|
| USB: | - |
| Paket Perangkat pemasok: | 783-FCPBGA (29x29) |
| Kecepatan: | 1.0GHz |
| Seri: | MPC85xx |
| Fitur keamanan: | Cryptography, Random Number Generator |
| SATA: | - |
| Pengontrol RAM: | DDR, DDR2, SDRAM |
| Pengemasan: | Tray |
| Paket / Case: | 783-BBGA, FCBGA |
| Suhu Operasional: | 0°C ~ 105°C (TA) |
| Jumlah Lengan / Lebar Bus: | 1 Core, 32-Bit |
| Tingkat Sensitivitas Kelembaban (MSL): | 3 (168 Hours) |
| Nomor Bagian Produsen: | MPC8547EPXAQGB |
| Akselerasi Grafis: | No |
| Deskripsi yang Diperluas: | PowerPC e500 Microprocessor IC MPC85xx 1 Core, 32-Bit 1.0GHz 783-FCPBGA (29x29) |
| Ethernet: | 10/100/1000 Mbps (4) |
| Display & Interface Controller: | - |
| Deskripsi: | IC MPU MPC85XX 1.0GHZ 783FCBGA |
| core Processor: | PowerPC e500 |
| Co-Prosesor / DSP: | Signal Processing; SPE, Security; SEC |
| Antarmuka Tambahan: | DUART, I²C, PCI, RapidIO |
| Email: | [email protected] |
bagian terkait untuk MPC8547EPXAQGB
Lastest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers